Cesic® - a silicon carbide composite material - is characterized by its extraordinary high specific stiffness, its very high thermal conductivity and, at the same time, its low coefficient of thermal expansion down to low temperatures. Due to the C-fiber reinforcement, Cesic® has a relatively high fracture toughness compared to other ceramic materials. In addition, the production of Cesic® components is quick and inexpensive and can be adapted to constructions of almost any complexity.