WHAT IS CESIC?
Cesic® is a ceramic composite material that is currently used primarily in the aerospace sector, in semiconductor technology, but also in industrial applications. Due to the carbon fiber reinforcement, Cesic® is more damage-tolerant compared to other silicon carbide materials such as SSiC and SiSiC. So far, Cesic® has mainly been used by our customers for
- Extremely light and thermally stable structures
- Optical mirrors and reflectors
- High-precision structures for cameras
- Special molded parts in the semiconductor industry
In addition to these applications, Cesic® is also used in the industrial sector for high temperature applications or for chemically aggressive media.
The advantages of Cesic®
Cesic® is characterized by very good mechanical and thermomechanical properties, such as high specific rigidity, mechanical stability and very good thermal conductivity, especially in the cryogenic range. In addition to its good mechanical properties, Cesic® also a very low coefficient of thermal expansion and thus high stability even with large temperature gradients. Due to the manufacturing process of Cesic® extreme light weighting of structural components is possible, even for complex geometries that can typically only be generated by 3D printing. All of our structures can be manufactured as monolithic components, but also as screwed assemblies. Due to the possibility of machining the components in the C / C state very close to their final shape, the machining times for light weighting are also very short and therefore no cost factor.
Material properties
Density 2.96 g / cm3
E-module 350 GPa
Strength 320 MPa with Weibull> 16
Specific stiffness 118 MPa-m3 / kg
Thermal expansion coefficient 2.3 10-6 / K
Thermal conductivity 200 W / mK @RT
355 W / mK @ 150K
Outgassing 0.00% RML
Poisson ratio 0.18
